7.0 PPC740 and PPC750 Microprocessor Package Description
The following sections provide the package parameters and the mechanical dimensions
for the PPC740 and PPC750.
7.1 Parameters for the 255 CBGA Package (PPC740)
The package parameters are as provided in the following list. The package type is 21 x
21 mm, 255-lead ceramic ball grid array (CBGA).
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter
21 x 21 mm
255 (16 x 16 ball array - 1)
1.27 mm (50 mil)
2.45 mm
3.00 mm
0.89 mm (35 mil)
Note:
The PPC740 (255 CBGA) package offering is
subject to availability
- see your IBM
marketing representative.
PPC740 and PPC750 Hardware Specifications
28 of 44
Preliminary and subject to change without notice
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