Figu re 14 (in part A) sh ows th e pin ou t of th e 360 CBGA package as viewed from th e top
su rface. Part B sh ows th e side profile of th e 360 CBGA package to in dicate th e direc-
tion of th e top su rface view.
17
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
18 19
Part A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
Part B
W
Not to Scale
View
Substrate Assembly.
Encapsulation
Die
Figure 14. Pinout of the PPC750 CBGA Package as Viewed from the Top Surface
21 of 44
PPC740 and PPC750 Hardware Specifications
Preliminary and subject to change without notice