PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Mechanical Dimensions of the 255 CBGA Package
Figure 14. Mechanical Dimensions and Bottom Surface Nomenclature of the 255 CBGA
Package
NOTES:
2X
Top View
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
0.2
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING FROM
D
A
A1 CORNER
MILLIMETERS
DIM MIN
MAX
3.00
1.00
1.10
0.93
A
A1
A2
b
2.45
0.80
0.90
0.82
D
D1
e
21.00 BSC
5.443 BSC
1.27 BSC
E
E1
E
E1
21.00 BSC
8.075 BSC
C
0.15 C
2X
0.2
D1
B
A1 CORNER
1
2
3
4
5
6
7
8
9 10111213141516
There is no ball
A
in the A01 position
B
C
D
E
F
G
H
J
e/2
X-ray view of balls
from top of package
K
L
M
N
P
R
T
e
0.3 C A B
e/2
b
A2
A1
C
0.15
255X
A
5/20/99
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
Page 27
IBM [ IBM ]
