PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
General Parameters
The following list provides a summary of the general parameters of the 750.
Technology
0.20µm CMOS (general lithography), six-layer copper metallization
0.12 ± 0.04µm Leff
2
Die Size
5.14mm x 7.78mm (40mm )
Transistor count
Logic design
Package
6.35 million
Fully-static
740: Surface mount 21x21mm, 255-lead ceramic ball grid array (CBGA)
750: Surface mount 25x25mm, 360-lead ceramic ball grid array (CBGA)
PPC 740/PPC 750 core
power supply
2v Nominal
I/O power supply
3.3V ± 5%
Page 6
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
IBM [ IBM ]
