PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
PowerPC 740 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PowerPC 740, a 255 pin ceramic ball grid array
(BGA) package.
Figure 13 (in part A) shows the pinout of the 255 CBGA package as viewed from the top surface. Part B
shows the side profile of the 255 CBGA package to indicate the direction of the top surface view.
Figure 13. Pinout of the PowerPC 740 BGA Package as Viewed from the Top Surface
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Part A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Not to Scale
Part B
View
Substrate Assembly.
Encapsulation
Die
Page 22
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
IBM [ IBM ]
