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IBM25EMPPC750LEBF4660 参数 Datasheet PDF下载

IBM25EMPPC750LEBF4660图片预览
型号: IBM25EMPPC750LEBF4660
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 466MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360]
分类和应用: 时钟外围集成电路
文件页数/大小: 50 页 / 600 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Embedded Microprocessor  
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L  
Thermal Management Information  
This section provides thermal management information for the CBGA package for air cooled applications.  
Proper thermal control design is primarily dependent upon the system-level design; that is, the heat sink, air  
flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be attached  
to the package by several methods: adhesive, spring clip to holes in the printed-circuit board or package, and  
mounting clip and screw assembly, see Figure 20.  
Figure 20. Package Exploded Cross-Sectional View with Several Heat Sink Options  
CBGA Package  
Heat Sink  
Heat Sink clip  
Adhesive  
or  
Thermal  
Interface  
Material  
Printed  
Circuit  
Board  
Option  
Maximum Heatsink Weight Limit for the 360 CBGA  
Force  
Maximum (pounds)  
Dynamic Compression  
Dynamic Tensile  
10.0  
2.5  
Static Constant (Spring Force)  
8.2  
5/20/99  
Version 1.51  
PowerPC 740 and PowerPC 750 Datasheet  
Page 39