CBGA Package
Heat Sink
Heat Sink clip
Adhesive
or
Thermal
Interface
Material
Printed
Circuit
Board
Option
Figure 19. Package Exploded Cross-Sectional View with Several Heat Sink Options
Th e board design er can ch oose between several types of h eat sin ks to place on th e
PPC740 an d PPC750. Th ere are several com m ercially-available h eat sin ks provided by
th e followin g ven dors:
Ch ip Coolers, In c.
800-227-0254 (USA/ Can ada)
401-739-7600
333 Strawberry Field Rd.
Warwick, RI 02887-6979
Th erm alloy
2021 W. Valley View Lan e
P.O. Box 810839
Dallas, TX 75731
214-243-4321
In t ern at ion al Elect ron ic Research Corporat ion (IERC)
135 W. Magn olia Blvd.
Bu rban k, CA 91502
818-842-7277
603-528-3400
Aavid En gin eerin g
On e Kool Path
Lacon ic, NH 03247-0440
Wak efi eld En gin eerin g
60 Au du bon Rd.
617-245-5900
Wakefield, MA 01880
PPC740 and PPC750 Hardware Specifications
36 of 43
Preliminary and subject to change without notice
IBM [ IBM ]
