Table 1 603e and EM603e General Parameters (Continued)
Parameter
Package
PID6
Surface mount 240-pin
C4 flat pack (C4FP), 240-
pin PFP w/molded
(EM603e only) heatsink
(MHS), or 255-pin
ceramic ball grid array
(CBGA)
3.3
±
5% Vdc
3.3
±
5% Vdc
0x0006
PID7v
Surface mount 255-pin
ceramic ball grid array
(CBGA)
PID7t
Surface mount 255-pin
ceramic ball grid array
(CBGA)
Core power supply
I/O power supply
PVR Number
2.5
±
5% Vdc
3.3
±
5% Vdc
0x007
2.5
±
5% Vdc
3.3
±
5% Vdc
0x007
1.4 Electrical and Thermal Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the 603e and
EM603e.
1.4.1 DC Electrical Characteristics
The tables in this section describe the 603e and EM603e DC electrical characteristics. Table 2 provides the
absolute maximum ratings.
Table 2. Absolute Maximum Ratings
1
Characteristic
Core supply voltage
PLL supply voltage
I/O supply voltage
Input voltage
Storage temperature range
Notes:
1. Functional and tested operating conditions are given in Table 3. Absolute maximum ratings are stress ratings
only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect
device reliability or cause permanent damage to the device.
Caution:
Vin must not exceed OVdd by more than 2.5 V at any time, including during power-on reset.
Caution:
OVdd must not exceed Vdd/AVdd by more than 1.2 V (2.5 V for PID6) at any time, including during
power-on reset.
Caution:
Vdd/AVdd must not exceed OVdd by more than 0.4 V at any time, including during power-on reset.
Symbol
Vdd
AVdd
OVdd
V
in
T
stg
PID6 Value
–0.3 to 4.0
–0.3 to 4.0
–0.3 to 4.0
–0.3 to 5.5
–55 to 150
PID7v Value
–0.3 to 2.75
–0.3 to 2.75
–0.3 to 3.6
–0.3 to 5.5
–55 to 150
PID7t Value
–0.3 to 2.75
–0.3 to 2.75
–0.3 to 3.6
–0.3 to 5.5
–55 to 150
Unit
V
V
V
V
°C
603e and EM603e Hardware Specification
5
IBM [ IBM ]
