Discontinuted (9/98 - last order; 3/99 last ship)
IBM11D1320L
IBM11D2320L
1M/2M x 32 DRAM Module
Pin Description
RAS0, RAS2
RAS0 - RAS3
CAS0 - CAS3
WE
A0 - A9
DQ0-7, 9-16, 18-25,
27-34
V
CC
V
SS
NC
PD1 - PD4
Row Address Strobe (4MB)
Row Address Strobe (8MB)
Column Address Strobe
Read/write Input
Address Inputs
Data Input/output
Power (+5V)
Ground
No Connect
Presence Detects
Pinout
Pin #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Name
V
SS
DQ0
DQ18
DQ1
DQ19
DQ2
DQ20
DQ3
DQ21
V
CC
NC
A0
A1
A2
A3
A4
A5
A6
NC
DQ4
DQ22
DQ5
DQ23
DQ6
Pin #
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
Name
DQ24
DQ7
DQ25
A7
NC
V
CC
A8
A9
RAS3*
RAS2
NC
NC
NC
NC
V
SS
CAS0
CAS2
CAS3
CAS1
RAS0
RAS1*
NC
WE
NC
Pin #
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
Name
DQ9
DQ27
DQ10
DQ28
DQ11
DQ29
DQ12
DQ30
DQ13
DQ31
V
CC
DQ32
DQ14
DQ33
DQ15
DQ34
DQ16
NC
PD1
PD2
PD3
PD4
NC
V
SS
1. DQ numbering is compatible with parity (x36) version.
2. * RAS1 and RAS3 are “NC” on 4MB SIMM.
Ordering Information
Part Number
IBM11D1320LC-60
IBM11D1320LC-70
IBM11D1320LD-60J
IBM11D1320LD-70J
IBM11D2320LC-60
IBM11D2320LC-70
IBM11D2320LD-60J
IBM11D2320LD-70J
2M x 32
1M x 32
Organization
Speed
60ns
70ns
60ns
70ns
60ns
70ns
60ns
70ns
10/10
Sn/Pb
4.25” x 1” x .154”
4.25” x 1” x .360”
D
E
TSOP
SOJ
1
1
Addr.
Leads
Dimensions
4.25” x 1” x .104”
4.25” x 1” x 205”
DRAM Die
Revison
D
E
1Mx16
Packages
TSOP
SOJ
1
1
Notes
1. DRAM package designator appended to speed portion of part number on assemblies beginning with DRAM die rev E.
©IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
50H7991
SA14-4334-02
Revised 8/96
Page 2 of 20
IBM [ IBM ]
