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IBM0118165MT3-50 参数 Datasheet PDF下载

IBM0118165MT3-50图片预览
型号: IBM0118165MT3-50
PDF下载: 下载PDF文件 查看货源
内容描述: [EDO DRAM, 1MX16, 50ns, CMOS, PDSO44, 0.400 X 0.825 INCH, TSOP2-50/44]
分类和应用: 动态存储器光电二极管内存集成电路
文件页数/大小: 31 页 / 350 K
品牌: IBM [ IBM ]
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IBM0118165 IBM0118165M
IBM0118165B IBM0118165P
1M x 16 10/10 EDO DRAM
Read Cycle
-50
Symbol
t
RAC
t
CAC
t
AA
t
OEA
t
RCS
t
RCH
t
RRH
t
RAL
t
CLZ
t
OFF
t
CDD
t
OEZ
t
OES
t
ORD
Parameter
Min.
Access Time from RAS
Access Time from CAS
Access Time from Address
Access Time from OE
Read Command Setup Time
Read Command Hold Time to CAS
Read Command Hold Time to RAS
Column Address to RAS Lead Time
CAS to Output in Low-Z
Output Buffer Turn-Off Delay
CAS to D
IN
Delay Time
Output Buffer Turn-Off Delay from OE
OE Setup Time Prior to CAS
OE Setup Time Prior to RAS (Hidden Refresh)
0
0
0
25
0
13
5
0
Max.
50
13
25
13
13
13
Min.
0
0
0
30
0
15
5
0
Max.
60
15
30
15
15
15
Min.
0
0
0
30
0
15
5
0
Max.
60
17
30
17
15
15
Min.
0
0
0
35
0
15
5
0
Max.
70
20
35
20
15
15
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
3
5, 6
7
5
4
4
1, 2, 3
1, 3
2, 3
3
-60
-6R
-70
Units
Notes
1. Operation within the t
RCD
(max.) limit ensures that t
RAC
(max.) can be met. t
RCD
(max.) is specified as a reference point only. If t
RCD
is greater than the specified t
RCD
(max.) limit, then access time is controlled by t
CAC
.
2. Operation within the t
RAD
(max.) limit ensures that t
RAC
(max.) can be met. t
RAD
(max.) is specified as a reference point only. If t
RAD
is greater than the specified t
RAD
(max.) limit, then access time is controlled by t
AA
.
3. Measured with the specified current load and 100pF at V
OL
= 0.8V and V
OH
= 2.0V.
4. Either t
RCH
or t
RRH
must be satisfied for a read cycle.
5. t
OFF
(max) and t
OEZ
(max) define the time at which the output achieves the open circuit condition and are not referenced to output
voltage levels.
6. t
OFF
is referenced from the rising edge of RAS or CAS, which ever is last.
7. Either t
CDD
or t
OED
must be satisfied.
28H4721
SA14-4223-01
Revised 12/95
©IBM Corporation, 1995. All rights reserved.
Use is further subject to the provisions at the end of this document.
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