HY29F400
ORDERING INFORMATION
Hynix products are available in several speeds, packages and operating temperature ranges. The
ordering part number is formed by combining a number of fields, as indicated below. Refer to the ‘Valid
Combinations’ table, which lists the configurations that are planned to be supported in volume. Please
contact your local Hynix representative or distributor to confirm current availability of specific configura-
tions and to determine if additional configurations have been released.
HY29F400
X
X
-
X
X
X
SPECIAL INSTRUCTIONS
TEMPERATURE RANGE
Blank = Commercial ( 0 to +70 °C)
SPEED OPTION
45 = 45 ns
55 = 55 ns
70 = 70 ns
90 = 90 ns
PACKAGE TYPE
G = 44-Pin Plastic Small Outline Package (PSOP)
T = 48-Pin Thin Small Outline Package (TSOP)
R = 48-Pin Thin Small Outline Package (TSOP) with
Reverse Pinout
BOOT BLOCK LOCATION
T= Top Boot Block Option
B= Bottom Boot Block Option
DEVICE NUMBER
HY29F400 = 4 Megabit (512K x 8/256K x 16) CMOS 5 Volt-Only
Sector Erase Flash Memory
VALID COMBINATIONS
Package and Speed
PSOP
TSOP
Reverse TSOP
Temperature
45 ns 55 ns 70 ns 90 ns 45 ns 55 ns 70 ns 90 ns 45 ns 55 ns 70 ns 90 ns
G-45 G-55 G-70 G-90 T-45 T-55 T-70 T-90 R-45 R-55 R-70 R-90
Commercial
Note:
1. The complete part number is formed by appending the Boot Block Location code and the suffix shown in the table above
to the Device Number. For example, the part number for a 90 ns, Commercial temperature range device in the reverse
TSOP package with the top boot block option is HY29F400TR-90.
Rev. 5.2/May 01
38
HYNIX [ HYNIX SEMICONDUCTOR ]
