Table of Contents
v
6.10.2.4 SRAM Multi-Cycle Write Access ................................. 6-30
6.10.3 MEM2 Read Access with WAIT Pin .............................................. 6-31
6.10.4 I/O Read Access .............................................................................. 6-32
6.10.5 I/O Read Access with WAIT Pin .................................................... 6-33
6.10.6 I/O Write Access ............................................................................. 6-34
6.10.7 DRAM............................................................................................. 6-35
6.10.7.1 Fast Page Mode DRAM Access ..................................... 6-35
6.10.7.2 EDO DRAM Single-Cycle Access................................. 6-36
6.10.7.3 EDO DRAM Multi-Cycle Access .................................. 6-37
6.10.7.4 DRAM Refresh(CAS Before RAS Refresh.................... 6-38
6.10 DC Characteristics ....................................................................................... 6-39
7. Mechanical Data
GMS30C2232, 160-Pin MQFP-Package....................................................... 7-1
7.1.1 Pin Configuration - View from Top Side............................................ 7-1
7.1.2 Pin Cross Reference by Pin Name ...................................................... 7-2
7.1.3 Pin Cross Reference by Location ........................................................ 7-3
7.2
GMS30C2232, 144-Pin TQFP-Package ........................................................ 7-4
7.2.1 Pin Configuration - View from Top Side............................................ 7-4
7.2.2 Pin Cross Reference by Pin Name ...................................................... 7-5
7.2.3 Pin Cross Reference by Location ........................................................ 7-6
7.3
GMS30C2216, 100-Pin TQFP-Package ........................................................ 7-7
7.3.1 Pin Configuration - View from Top Side............................................ 7-7
7.3.2 Pin Cross Reference by Pin Name ...................................................... 7-8
7.3.3 Pin Cross Reference by Location ........................................................ 7-9
7.4 Package-Dimensions...................................................................................... 7-10
Appendix. Instruction Set Detail
7.1
HYNIX [ HYNIX SEMICONDUCTOR ]
