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HWL27NC 参数 Datasheet PDF下载

HWL27NC图片预览
型号: HWL27NC
PDF下载: 下载PDF文件 查看货源
内容描述: L波段大功率场效应管导通孔芯片 [L-Band Power FET Via Hole Chip]
分类和应用: 晶体晶体管放大器
文件页数/大小: 2 页 / 77 K
品牌: HW [ HEXAWAVE, INC ]
 浏览型号HWL27NC的Datasheet PDF文件第2页  
HWL27NC
L-Band Power FET Via Hole Chip
Autumn 2002 V1
Features
Low Cost GaAs Power FET
Class A or Class AB Operation
17 dB Typical Gain at 2.4 GHz
5V to 10V Operation
650
Outline Dimensions
Source
Description
The HWL27NC is a medium power GaAs FET
designed for various L-band & S-band applications.
435
1
3
Absolute Maximum Ratings
V
DS
V
GS
I
D
I
G
T
CH
T
STG
P
T
*
215
2
4
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Gate Current
Channel Temperature
Storage Temperature
Power Dissipation
+15V
-5V
I
DSS
0.0
Source
2mA
175
°
C
-65 to +175
°
C
3.5W
0.0 58.5
344.5 400
* mounted on an infinite heat sink
Unit:
µm
Thickness: 100
±
5
Chip size
±
50
Bond Pads 1-2 (Gate):
Bond Pads 3-4 (Drain):
60 x 60
60 x 60
Electrical Specifications
(T
A
=25
°
C) f = 2.4 GHz for all RF Tests
Symbol
I
DSS
Parameters & Conditions
Saturated Current at V
DS
=3V, V
GS
=0V
Units
mA
Min.
300
Typ.
400
Max.
600
V
P
Pinch-off Voltage at V
DS
=3V, I
D
=20mA
V
-3.5
-2.0
-1.5
g
m
P
1dB
Transconductance at V
DS
=3V, I
D
=200mA
Power Output at Test Points
V
DS
=10V, I
D
=0.5 I
DSS
Gain at 1dB Compression Point
V
DS
=10V, I
D
=0.5 I
DSS
Power-Added Efficiency (P
OUT
= P
1dB
)
V
DS
=10V, I
D
=0.5 I
DSS
mS
-
250
-
dBm
28
29
-
G
1dB
dB
15
16
-
PAE
%
30
40
-
Small Signal Common Source Scattering Parameters
Hexawave Inc. 2 Prosperity Road II, Science Park, Hsinchu, Taiwan, R.O.C.. TEL 886-3-578-5100 FAX 886-3-577-0512
http://www.hw.com.tw
Email:
sales@hw.com.tw
All specifications are subject to change without notice.