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TJ3964 参数 Datasheet PDF下载

TJ3964图片预览
型号: TJ3964
PDF下载: 下载PDF文件 查看货源
内容描述: 1A超低压差线性稳压器 [1A Ultra Low Dropout Linear Regulator]
分类和应用: 稳压器
文件页数/大小: 11 页 / 331 K
品牌: HTC [ HTC KOREA TAEJIN TECHNOLOGY CO. ]
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1A Ultra Low Dropout Linear Regulator  
TJ3964  
Table. 1. Absolute Maximum Ratings of Thermal Resistance  
No heat sink / No air flow / No adjacent heat source / TA = 25°C  
Characteristic  
Symbol  
θJA-SOT23-5  
θJA-SOP-8  
Rating  
265  
Unit  
Thermal Resistance Junction-To-Ambient / SOT23-5  
Thermal Resistance Junction-To-Ambient / SOP-8  
Thermal Resistance Junction-To-Ambient / SOT223  
Thermal Resistance Junction-To-Ambient / TO252  
°C/W  
°C/W  
°C/W  
°C/W  
165  
θJA-SOT223  
θJA-TO252  
140  
105  
In case that there is no cooling solution and no heat sink / minimum copper plane area for heat sink, the  
maximum allowable power dissipation of each package is as follow;  
Characteristic  
Symbol  
Rating  
Unit  
Maximum Allowable Power Dissipation at TA=25°C / SOT23-5  
Maximum Allowable Power Dissipation at TA=25°C / SOP-8  
Maximum Allowable Power Dissipation at TA=25°C / SOT223  
Maximum Allowable Power Dissipation at TA=25°C / TO252  
PDMax-SOT23-5  
PDMax-SOP-8  
PDMax-SOT223  
PDMax-TO252  
0.378  
0.606  
0.714  
0.952  
W
W
W
W
- Please note that above maximum allowable power dissipation is based on the minimum copper  
plane area which does not exceed the proper footprint of the package. And the ambient  
temperature is 25°C.  
If proper cooling solution such as heat sink, copper plane area, air flow is applied, the maximum allowable  
power dissipation could be increased. However, if the ambient temperature is increased, the allowable  
power dissipation would be decreased.  
For example, in case of SOT-223 and TO-252 package, θJA-SOT223 is 140 °C/W and θJA-TO52 is 105 °C/W,  
however, as shown in below graph, θJA could be decreased with respect to the copper plane area. So,  
the specification of maximum power dissipation for an application is fixed, the proper copper plane area  
could be estimated by following graphs. As shown in graph, wider copper plane area leads lower θJA.  
Junction To Ambient Thermal Resistance, θJA  
vs. 1 ounce Copper Area [SOT-223 Package]  
Junction To Ambient Thermal Resistance, θJA  
vs. 2 ounce Copper Area [TO-252 Package]  
Dec. 2009 – Rev. 1.1  
- 10 -  
HTC