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TJ3964GSF5-1.5 参数 Datasheet PDF下载

TJ3964GSF5-1.5图片预览
型号: TJ3964GSF5-1.5
PDF下载: 下载PDF文件 查看货源
内容描述: 1A超低压差线性稳压器 [1A Ultra Low Dropout Linear Regulator]
分类和应用: 稳压器
文件页数/大小: 11 页 / 331 K
品牌: HTC [ HTC KOREA TAEJIN TECHNOLOGY CO. ]
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1A Ultra Low Dropout Linear Regulator  
TJ3964  
Output Capacitor  
The TJ3964 requires a proper output capacitance to maintain stability and improve transient response  
over current. The ESR of the output capacitor within the limits of 0.5to 10is required. A minimum  
capacitance value of 22µF of tantalum or aluminum electrolytic capacitor is recommended. In a case of  
ceramic capacitor, a minimum capacitance value of 10µF is required and additional resistance of  
minimum 1should be added with the output capacitor in series to maintain its minimum ESR. The  
resistance and capacitance have to be varied upon the load current.  
VOUT  
ADJ  
OUTPUT  
VOUT  
ADJ  
OUTPUT  
R2  
R1  
R2  
R1  
+
Additional Resistance  
22µF  
-
GND  
GND  
10µF  
Maximum Output Current Capability  
The TJ3964 can deliver a continuous current of 1A over the full operating junction temperature range.  
However, the output current is limited by the restriction of power dissipation which differs from packages.  
A heat sink may be required depending on the maximum power dissipation and maximum ambient  
temperature of application. With respect to the applied package, the maximum output current of 1A may  
be still undeliverable due to the restriction of the power dissipation of TJ3964. Under all possible  
conditions, the junction temperature must be within the range specified under operating conditions.  
The temperatures over the device are given by:  
TC = TA + PD X θCA  
/ TJ = TC + PD X θJC / TJ = TA + PD X θJA  
where TJ is the junction temperature, TC is the case temperature, TA is the ambient temperature, PD is the  
total power dissipation of the device, θCA is the thermal resistance of case-to-ambient, θJC is the thermal  
resistance of junction-to-case, and θJA is the thermal resistance of junction to ambient.  
The total power dissipation of the device is given by:  
PD = PIN – POUT = (VIN X IIN)–(VOUT X IOUT  
)
= (VIN X (IOUT+IGND)) – (VOUT X IOUT) = (VIN - VOUT) X IOUT + VIN X IGND  
where IGND is the operating ground current of the device which is specified at the Electrical Characteristics.  
The maximum allowable temperature rise (TRmax) depends on the maximum ambient temperature (TAmax  
)
of the application, and the maximum allowable junction temperature (TJmax):  
TRmax = TJmax – TAmax  
The maximum allowable value for junction-to-ambient thermal resistance, θJA, can be calculated using the  
formula:  
θ
JA = TRmax / PD = (TJmax – TAmax) / PD  
TJ3964 is available in SOT23-5, SOT-223, TO-252 and SOP-8 packages. The thermal resistance  
depends on amount of copper area or heat sink, and on air flow. If the maximum allowable value of θJA  
calculated above is as described in Table 1, no heat sink is needed since the package can dissipate  
enough heat to satisfy these requirements. If the value for allowable θJA falls near or below these limits, a  
heat sink or proper area of copper plane is required.  
Dec. 2009 – Rev. 1.1  
- 9 -  
HTC  
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