欢迎访问ic37.com |
会员登录 免费注册
发布采购

TJ1509AD-ADJ 参数 Datasheet PDF下载

TJ1509AD-ADJ图片预览
型号: TJ1509AD-ADJ
PDF下载: 下载PDF文件 查看货源
内容描述: 为150KHz , 2A PWM降压型DC / DC转换器 [150kHz, 2A PWM Buck DC/DC Converter]
分类和应用: 转换器
文件页数/大小: 8 页 / 791 K
品牌: HTC [ HTC KOREA TAEJIN TECHNOLOGY CO. ]
 浏览型号TJ1509AD-ADJ的Datasheet PDF文件第1页浏览型号TJ1509AD-ADJ的Datasheet PDF文件第2页浏览型号TJ1509AD-ADJ的Datasheet PDF文件第3页浏览型号TJ1509AD-ADJ的Datasheet PDF文件第4页浏览型号TJ1509AD-ADJ的Datasheet PDF文件第5页浏览型号TJ1509AD-ADJ的Datasheet PDF文件第6页浏览型号TJ1509AD-ADJ的Datasheet PDF文件第7页  
150kHz, 2A PWM Buck DC/DC Converter  
TJ1509A  
FUNCTION DESCRIPTION  
Pin Functions  
+VIN  
This is the positive input supply for the IC switching regulator. A suitable input bypass capacitor must be present  
at this pin to minimize voltage transients and to supply the switching currents needed by the regulator.  
Ground  
Circuit ground.  
Output  
Internal switch. The voltage at this pin switches between (+VIN – VSAT) and approximately – 0.5V, with a duty  
cycle of approximately VOUT / VIN. To minimize coupling to sensitive circuitry, the PC board copper area  
connected to this pin should be kept a minimum.  
Feedback(FB)  
Senses the regulated output voltage to complete the feedback loop.  
ON/OFF (SD)  
Allows the switching regulator circuit to be shutdown using logic level signals thus dropping the total input supply  
current to approximately 150uA. Pulling this pin below a threshold voltage of approximately 1.3V turns the  
regulator on, and pulling this pin above 1.3V (up to a maximum of 18V) shuts the regulator down. If this  
shutdown feature is not needed, the SD pin can be wired to the ground pin or it can be left open, in either case  
the regulator will be in the ON condition.  
Thermal Considerations  
The SOP-8 package needs a heat sink under most conditions. The size of the heatsink depends on the input  
voltage, the output voltage, the load current and the ambient temperature. The TJ1509A junction temperature  
rises above ambient temperature for a 3A load and different input and output voltages. The data for these curves  
was taken with the TJ1509A (SOP-8 package) operating as a buck-switching regulator in an ambient temperature  
of 25(still air). These temperature rise numbers are all approximate and there are many factors that can affect  
these temperatures. Higher ambient temperatures require more heat sinking.  
For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper  
should be used in the board layout. [Once exception to this is the output (switch) pin, which should not have large  
areas of copper.] Large areas of copper provide the best transfer of heat (lower thermal resistance) to the  
surrounding air, and moving air lowers the thermal resistance even further.  
Package thermal resistance and junction temperature rise numbers are all approximate, and there are many  
factors that will affect these numbers. Some of these factors include board size, shape, thickness, position,  
location, and even board temperature. Other factors are, trace width, total printed circuit copper area, copper  
thickness, single or double-sided, multi-layer board and the amount of solder on the board.  
The effectiveness of the PC board to dissipate heat also depends on the size, quantity and spacing of other  
components on the board, as well as whether the surrounding air is still or moving. Furthermore, some of these  
components such as the catch diode will add heat to the PC board and the heat can vary as the input voltage  
changes. For the inductor, depending on the physical size, type of core material and the DC resistance, it could  
either act as a heat sink taking heat away from the board, or it could add heat to the board.  
HTC  
- 8 -  
 复制成功!