HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 3/4
IR Reflow Profile
260
240
220
200
250
10+/-2 sec
300
Temperature Profile for Dip Soldering
10+/-2 sec
Temperature( C)
Temperature( C)
180
160
140
120
100
80
60
40
20
0
0
50
100
150
200
250
300
150+/-30
40+/-20 sec
o
o
200
150
100
120+/-20 sec
50
0
0
50
100
150
200
250
300
350
Time(sec)
Time(sec)
Power Temperature Derating
900
800
PD , Power Dissipation (mW)
700
600
500
400
300
200
100
0
0
20
40
60
80
100
o
120
140
160
Ta , Case Temperature ( C)
HSD471A
HSMC Product Specification