HI-SINCERITY
MICROELECTRONICS CORP.
DIP- 8 package dimension
8
7
6
5
Spec. No. : IC200916
Issued Date : 2009.09.12
Revised Date :
Page No. : 5/5
Marking:
Pb Free Mark
A
1
2
3
4
Pb-Free: "
.
"
(Note)
Normal: None
H
9 60
P
B
F
J
Date Code
Control Code
Pin Style: 1.OB 2.CT 3.GND 4.FB
5.VCC 6.OE 7.OC 8.OC
Material:
•
Lead solder plating: Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
C
E
D
G
H
α
1 K
M
L
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
α
1
Min.
6.29
9.22
-
-
-
3.25
3.17
0.38
2.28
7.49
-
8.56
0.229
o
94
Max.
6.40
9.32
*1.52
*1.27
*0.99
3.35
3.55
0.53
2.79
7.74
*3.00
8.81
0.381
o
97
*: Typical, Unit: mm
I
8-Lead DIP-8
Plastic Package
HSMC Package Code: P
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 5/F., Golden Harvest Building 15 Wang Chiu Road, Kowloon Bay, Hong Kong
Tel: +852-2755-7162 Fax: +852-2755- 7795
AVANTICS : Shanghai Address: No.399, Cai Lum Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai 201210, China
Tel: +86(21) 61637118 Fax: +86(21)61637006
H960
HSMC Product Specification
HSMC [ HI-SINCERITY MOCROELECTRONICS ]
