Spec. No. : IC200405
Issued Date : 2004.04.01
Revised Date : 2006.01.19
Page No. : 12/12
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
t
P
Critical Zone
to T
TP
T
L
P
Ramp-up
TL
t
L
Tsmax
Tsmin
tS
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
Sn-Pb Eutectic Assembly
<3oC/sec
Pb-Free Assembly
<3oC/sec
- Temperature Min (Tsmin
)
100oC
150oC
150oC
200oC
- Temperature Max (Tsmax
- Time (min to max) (ts)
Tsmax to TL
)
60~120 sec
60~180 sec
- Ramp-up Rate
<3oC/sec
<3oC/sec
Time maintained above:
- Temperature (TL)
- Time (tL)
183oC
217oC
60~150 sec
240oC +0/-5oC
60~150 sec
260oC +0/-5oC
Peak Temperature (TP)
Time within 5oC of actual Peak
10~30 sec
20~40 sec
Temperature (tP)
Ramp-down Rate
<6oC/sec
<6oC/sec
Time 25oC to Peak Temperature
<6 minutes
<8 minutes
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Peak temperature
245oC ±5oC
Dipping time
10sec ±1sec
10sec ±1sec
260oC ±5oC
Pb-Free devices.
H78XXAJ / BJ, H78XXAI / BI, H78XXANE / BNE, H78XXAE / BE
HSMC Product Specification