Spec. No. : IC200405
Issued Date : 2004.04.01
Revised Date : 2006.01.19
Page No. : 11/12
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-82 Dimension
A
B
DIM
A
Min.
7.57
Max.
7.67
Marking:
r1
B
5.44
3.78
10.88
10.25
-
-
1.16
-
4.52
2.49
5.54
3.98
Pb Free Mark
Product Series
(05,06,08,09,12)
C
D
E
C
(Note)
Pb-Free: " . "
H
NE
r2
10.98
10.75
*1.27
*0.76
1.26
*0.76
4.62
2.59
Normal: None
7 8
D
E
F
L
G
H
I
J
K
Date Code
Control Code
H
1
2
3
Note: Green label is used for pb-free packing
Pin Style: 1.Input 2.Ground 3.Output
a1
a1
F
I
L
1.10
-
1.22
-
-
-
-
1.20
Material:
M
N
a1
r1
r2
r3
*0.60
1.32
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
G
*3o
φ3.10
R1.70
R0.20
J
M
N
K
3-Lead SOT-82
Plastic Package
HSMC Package Code: NE
*: Typical, Unit: mm
a1
a1
r3
TO-220AB Dimension
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Min.
5.58
8.38
4.40
1.15
0.35
2.03
9.66
-
Max.
7.49
8.90
4.70
1.39
0.60
2.92
10.28
*16.25
*3.83
4.00
0.95
3.42
1.40
*2.54
14.27
15.87
Marking:
F
A
B
Pb Free Mark
(Note)
Pb-Free: " . "
Product Series
(05,06,08,09,12)
E
Normal: None
H
E
C
D
7 8
Date Code
Control Code
H
K
-
M
Note: Green label is used for pb-free packing
Pin Style: 1.Input 2.Ground 3.Output
I
3.00
0.75
2.54
1.14
-
3
N
G
L
2
1
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
Tab
12.70
14.48
P
O
J
*: Typical, Unit: mm
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H78XXAJ / BJ, H78XXAI / BI, H78XXANE / BNE, H78XXAE / BE
HSMC Product Specification
HSMC [ HI-SINCERITY MOCROELECTRONICS ]
