HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
C
H
Spec. No. : IC200404
Issued Date : 2004.03.01
Revised Date : 2005.03.25
Page No. : 5/7
Marking:
Date Code
HSMC Logo
H 4 3 2
Control Code
Pb-Free: "
.
"
(Note)
Normal: None
Pb Free Mark
B
1
E
F
G
A
2
3
D
Note: Green label is used for pb-free packing
J
I
Pin Style: 1.Reference 2.Anode 3.Cathode
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
Min.
4.40
4.05
1.50
2.40
0.36
*1.50
*3.00
1.40
0.35
Max.
4.60
4.25
1.70
2.60
0.51
-
-
1.60
0.41
*: Typical, Unit: mm
3-Lead SOT-89 Plastic
Surface Mounted Package
HSMC Package Code: M
TO-92 Dimension
A
B
1
2
3
α
2
Marking:
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
H
4 3 2
A
α
3
Date Code
Control Code
C
Note: Green label is used for pb-free packing
D
Pin Style: 1.Reference 2.Anode 3.Cathode
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
α1
α2
α3
Min.
4.33
4.33
12.70
0.36
-
3.36
0.36
-
-
-
-
-
Max.
4.83
4.83
-
0.56
*1.27
3.76
0.56
*2.54
*1.27
*5°
*2°
*2°
H
I
E
F
G
*: Typical, Unit: mm
α
1
3-Lead TO-92 Plastic Package
HSMC Package Code: A
H432 Series
HSMC Product Specification
HSMC [ HI-SINCERITY MOCROELECTRONICS ]
