HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23-6L (TSOP-6) package dimension
Marking:
Spec. No. : IC200401
Issued Date : 2004.03.01
Revised Date : 2009.08.12
Page No. : 8/8
Pin Style: 1. Vctrl 2. GND 3. Vout
4.Ictrl 5. Vsense 6.
Vcc
Material:
•
Lead solder plating: Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class:
UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
Min.
2.70
2.60
1.40
0.30
0.00
0°
1.80
-
0.10
0.30
Max.
3.12
3.00
1.80
0.55
0.10
10°
2.00
1.30
0.21
0.60
0.6*
0.95*
0.25*
1.00
1.20
*: Typical, Unit: mm
SOT-23-6L(TSOP-6) Surface Mounted Package
HSMC Package Code: N
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMCS assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
AVANTICS Microelectronics Corp: No. 255, Cai Lun Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai, China
Tel: 86-021-61637118 Fax: 86-021-58558038
H134 Series
HSMC Product Specification
HSMC [ HI-SINCERITY MOCROELECTRONICS ]
