Spec. No. : MOS200403
Issued Date : 2004.07.01
Revised Date : 2005.07.14
Page No. : 3/6
HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
DIM
A
C
F
G
Min.
6.35
4.80
1.30
5.40
2.20
0.40
2.20
0.90
0.40
-
Max.
6.80
5.50
1.70
6.25
3.00
0.90
2.40
1.50
0.65
*2.30
1.05
Marking:
M
A
C
a1
Pb Free Mark
(Note)
Pb-Free: " . "
H
J
Normal: None
0 2 N 6 0
F
H
L
Date Code
Control Code
M
N
a1
a2
a5
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
G
Material:
0.65
N
2
3
1
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
*: Typical, Unit: mm
H
a5
L
a1
a2
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
a1
a2
y1
y2
Min.
6.40
-
5.04
-
Max.
6.80
6.00
5.64
*4.34
0.80
0.90
6.30
2.90
9.80
1.00
0.96
0.86
2.40
1.10
1.22
0.60
2.50
5o
Marking:
A
B
C
D
a1
Pb Free Mark
M
(Note)
Pb-Free: " . "
H
J
Normal: None
F
a1
0 2 N 6 0
y1
0.40
0.50
5.90
2.50
9.20
0.60
-
0.66
2.20
0.70
0.82
0.40
2.10
-
E
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
G I
H
y1
y1
N
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
J
K
L
a1
O
a2
a2
y2
y2
-
3o
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
*: Typical, Unit: mm
H02N60I, H02N60J, H02N60E, H02N60F
HSMC Product Specification
HSMC [ HI-SINCERITY MOCROELECTRONICS ]
