BRecommended Temperature Profile
MAX 230ç(5sec.Max.)
250
230ç
200
150
100
50
200ç
Applicable
Reflow method
Solder
: IR reflow
150ç
: Paste type 63 Sn/37 Pb
(Flux content 9%/wt)
: Glass epoxy 85∞60∞1.6mm
Test board
Metal mask thichness : 0.2mm
Recommended temperature profile
The temperature may be slightly changed according to the
solder paste type and amount.
25ç
(60sec.)
60sec.
Preheating
(40sec.)
Soldering
0
Start
60
120
Time (Secounds)
BFunctional Block Chart
Receptacle and Socket Side
Pin Header Side
A3 (A)-*DA-2SV
A3 (A)-*PA-2SV
Straight SMT Type
Straight SMT Type
A3 (A)-*DA-2DSA(DSC, DSE)
A3C-*P-2DSA
Straight Through hole Type
Straight Through hole (low profile) Type
A3B-*PA-2DSA
Straight Through hole Type
A3B-*D-2C
Cable crimping type
A3B-*PA-2DS
Right Angle Through hole Type
C24
HRS [ HRS ]
