A3 • A4 Series●2mm Pitch Miniature Connector
BRecommended Temperature Profile
HRS test conditions
260
Test boardGlass epoxy 85mm∞60mm∞1.6mm thick
MAX250ç
Solder method
: Reflow
240
220ç
Solder composition
: Paste,
220
200
200ç
96.5%Sn/3%Ag/0.5%Cu
: 0.2mm thick
: 2 cycles
Metal mask
Reflow cycles
180
160
150ç
140
The temperature profile is based on the above
conditions.
In individual applications the actual temperature may
vary, depending on solder paste type,
volume/thickness and board size/thickness. Consult
your solder paste and equipment manufacturer for
specific recommendations.
0
90 to 120 sec.
MAX 60 sec.
Time (sec.)
Preheating(150 to 200ç)
Soldering
(220ç min)
BFunctional Block Chart
Receptacle and Socket Side
Pin Header Side
A3 (A)-*DA-2SV
A3 (A)-*PA-2SV
Straight SMT Type
Straight SMT Type
A3 (A)-*DA-2DSA(DSC, DSE)
A3C-*P-2DSA
Straight Through hole Type
Straight Through hole (low profile) Type
A3B-*PA-2DSA
Straight Through hole Type
A3B-*D-2C
Cable crimping type
A3B-*PA-2DS
Right Angle Through hole Type
C24
HRS [ HRS ]
