DF52 Series●0.8mm Pitch, Compact and Robust Wire-to-Board Connectors
B
Applicable crimping tools
Type
Applicator
Part No.
AP105-DF52-2832P
DHS877900H-UP
HRS No.
901-4636-7
−
Applicable contact
DF52-2832PCF
DF52-2832PCF
−
Remarks
(Note 2) Manufactured by Japan
Automatic Machine Co.,Ltd.
Press body CM-105C
Pull-out tool DF-C-PO(A)
901-0001-0 00
550-0170-8 00
DF52-2832PCF
Note 1 : Issues caused by using other than our specified tools are not covered by warranty.
Note 2 : Please contact Japan Automatic Machine Co., Ltd. (hereinafter J.A.M.) through their website regarding defective
crimping of adapting applicators manufactured by J.A.M.
URL http://www.jam-net.co.jp
Sep.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
B
Precautions
1. Recommended
Temperature Profile
(Compatible with lead-
free soldering)
10sec MAX
MAX 250℃
20
5
2 0℃
2
20
0
TEMPERATURE
(℃)
1 0℃
8
10
5
10
0
0
90-120sec
PRE-HEATING TIME
60sec MAX
TIME (Sec)
SOLDERING TIME
2. Recommended
manual soldering
conditions
3. Recommended screen Thickness : 0.1mm, aperture opening ratio : 100%
thickness and
aperture ratio
(Pattern surface ratio)
4. Warpage of the Board A maximum of 0.02mm at the center of connector, as measured from either
end of the connector
IPA cleaning is allowed. (Cleaning is not recommended due to potential changes in
5. Cleaning Conditions
mating action and other variables. Please contact us if you use other cleaning agents. )
6. Noteworthy Points
[Applicable Conditions]
1. Peak temperature : 250
℃
max.
2. Heating area : 220
℃
min. for less than 60 seconds
3. Preheating area : 150
℃
to 180
℃
for 90 to 120 seconds
4. Number of times : no more than 2 times
* Measurement is conducted at the contact lead part
Soldering results may change depending on conditions such as solder
paste type, manufacturer, PCB size, and other soldering materials. Please
determine all mounting conditions before use.
Note 1 : This temperature profile is a recommended value.
Temperature of soldering iron : 350
±
10
℃
, soldering time : within 3 seconds
■
Please note that any mating operation of the connector when not mounted
on the board may cause damage or deformation of the contacts.
■
During hand soldering, do not apply flux, as it will flow over the connector.
■
This housing color may have slight variations depending on the production
lot. This color variation does not affect performance.
■
Please refer to DF52 mating and unmating Procedure Document
(ETAD-H0788) for points in handling regarding mating operations.
■
Please refer to Harness procedure manual (ETAD-H0791) for points in
harness operations.
5