10HSI-S008-R0-C 参数 Datasheet PDF下载

Signal Integrity Report – IT3 (32mm)

Page ii

Table of Contents

Table of Contents .......................................................................................................................... ii

1. Introduction..............................................................................................................................4

2. Geometry ..................................................................................................................................4

3. Differential Signals ..................................................................................................................5

3.1

Frequency-Domain Modeling...................................................................................................... 5

3.1.1 S parameters (connector only)................................................................................................. 5

3.1.2 S parameters (vias only)........................................................................................................ 15

3.1.3 S parameters (vias + connector + vias) ................................................................................. 18

3.1.4 W-element Model (PCB trace).............................................................................................. 23

3.2

Time-Domain Simulation .......................................................................................................... 26

3.2.1 Impedance Profile (connector only)...................................................................................... 26

3.2.2 Impedance Profile (vias + connector + vias)......................................................................... 28

3.2.3 TDR and TDT waveforms (connector only) ......................................................................... 29

3.2.4 Time-Domain Crosstalk (connector only)............................................................................. 35

3.2.5 System Voltage and Timing Margins.................................................................................... 36

4.1

Frequency-Domain Modeling.................................................................................................... 46

4.1.1 S parameters (connector only)............................................................................................... 46

4.1.2 S parameters (vias only)........................................................................................................ 48

4.1.3 S parameters (vias + connector + vias) ................................................................................. 48

4.1.4 W-element Model (PCB trace).............................................................................................. 50

4.2

Time-Domain Simulation .......................................................................................................... 52

4.2.1 Impedance Profile (connector only)...................................................................................... 52

4.2.2 Impedance Profile (via + connector + via)............................................................................ 54

4.2.3 TDR and TDT waveforms (connector only) ......................................................................... 56

4.2.4 Time-Domain Crosstalk (connector only)............................................................................. 57

4.2.5 System Voltage and Timing Margins.................................................................................... 58

5.1

Measurement Setup ................................................................................................................... 60

5.2

Differential Signals.................................................................................................................... 61

5.2.1 Measurement vs. Simulation Correlation (connector only) .................................................. 61

5.2.2 Time-Domain NEXT and FEXT........................................................................................... 65

5.2.3 Impedance profile.................................................................................................................. 66

5.3

Single-ended Signals ................................................................................................................. 66

5.3.1 Measurement vs. Simulation Correlation (connector only) .................................................. 66

5.3.2 Time-Domain NEXT and FEXT........................................................................................... 68

5.3.3 Impedance profile.................................................................................................................. 69

4. Single-ended Signals ..............................................................................................................46

5. Measurement ..........................................................................................................................60

6. Appendix.................................................................................................................................69