0.5
0.4
0.3
0.2
0.1
0
1.0
0.8
0.6
0.4
0.2
0
GaP/AlGaAs/
AlInGaP
-0.1
-0.2
-0.3
InGaN/GaN
50
TEMPERATURE – °C
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
-100
-50
0
100
150
ANGULAR DISPLACEMENT – DEGREES
Figure 6. Forward voltage shift vs. temperature.
Figure 7. Radiation Pattern.
10 to 20 SEC.
+5 °C
-0 °C
255 °C
217 °C
20 SEC. MAX.
3 °C/SEC. MAX.
6 °C/SEC. MAX.
125 °C ± 25 °C
240°C MAX.
3°C/SEC. MAX.
100-150°C
183°C
MAX. 120 SEC.
60 to 150 SEC.
–6°C/SEC.
MAX.
3°C/SEC.
MAX.
120 SEC. MAX. 60-150 SEC.
TIME
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 8a. Recommended SnPb reflow soldering profile.
Figure 8b. Recommended Pb-free reflow soldering profile.
4.50
1.50
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
2.60
250
200
150
100
FLUXING
PREHEAT
BOTTOM SIDE
OF PC BOARD
50
30
TOP SIDE OF
PC BOARD
0
10 20 30 40 50 60 70 80 90 100
TIME – SECONDS
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
SOLDER RESIST
Figure 9. Recommended wave soldering profile.
Figure 10. Recommended soldering pad pattern.
9
HP [ HEWLETT-PACKARD ]
