Package Information
HDMP-0482 Thermal Characteristics, TC = 0°C to 85°C, VCC = 3.15V to 3.45V
Symbol
Parameter
Unit
Typ.
Max.
θjc
Thermal Resistance, Junction to Case
°C/W
9.5
—
Note: Based on independent testing by Agilent. θja for these devices is 39.4°C/W for the HDMP-0482.
ja is measured on a standard 3x3” FR4 PCB in a still air environment. To determine the actual
θ
junction temperature in a given application, use the following equation: Tj =TC + (θjc x PD), where TC
is the case temperature measured on the top center of the package, and PD is the power being
dissipated.
Item
Details
Package Material
Lead Finish Material
Lead Finish Thickness
Lead Skew
Plastic
85% Tin, 15% Lead
300–800 micro-inches
0.20 mm max.
Lead Coplanarity
0.10 mm max.
(Seating Plane Method)
PIN #1 ID
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
48
47
46
45
44
43
42
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
HDMP-0482
TOP VIEW
41
40
E1
E
39
38
37
36
35
34
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
G
c
b
D1
D
L
e
A2
A
A1
Figure 10. HDMP-0482 Package Drawing.
Mechanical Dimensions of HDMP-0482
Dimensional Parameter
(in millmeters)
D1/E1
D/E
17.20
0.25
b
e
L
c
G
A2
A1
A
HDMP-0482
14.00
0.10
0.35
0.80
Basic
0.88
0.17
0.25
2.00
0.25
Max
2.35
Max
Tolerance
0.05
+0.15/ Max
-0.10
Gage
Plane
+0.10/
-0.05
11
HP [ HEWLETT-PACKARD ]
