2
Package Dimensions
32.77
(1.290)
8.26
(0.325)
0.38
(0.015)
0.25 TYP.
(0.010)
10.03
(0.395)
6.86
(0.270)
10.16
(0.400)
15.24
(0.600)
20.07
(0.790)
PIN 1 IDENTIFIER
4.45
(0.175)
2.41 TYP.
(0.095)
8.64
(0.340)
4.06
(0.160)
PIN NO.
1
2
3
4
5
6
7
8
9
10
11
FUNCTION
NO CONNECT
NO CONNECT
CE1
CE2
CLR
V
DD
A0
A1
WR
CU
CUE
PIN NO.
12
13
14
15
16
17
18
19
20
21
22
FUNCTION
GROUND
NO CONNECT
BL
NO CONNECT
D0
D1
D2
D3
D4
D5
D6
0.51 TYP.
(0.020)
2.54 TYP.
(0.100)
NOTES:
1. UNLESS OTHERWISE SPECIFIED, THE TOLERANCE ON ALL
DIMENSIONS IS ± 0.254 mm (± 0.010).
2. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
Absolute Maximum Ratings
Supply Voltage, V
DD
to Ground
[1]
...................................... -0.5 V to 7.0 V
Input Voltage, Any Pin to Ground .......................... -0.5 V to V
DD
+ 0.5 V
Free Air Operating Temperature Range, T
A
..................... -40°C to +85°C
Storage Temperature, T
S
................................................. -40°C to +85°C
CMOS IC Junction Temperature, T
J
(IC) .................................... +150°C
Relative Humidity (non-condensing) at 65°C .................................... 85%
Wave Solder Temperature,
1.59 mm (0.063 in.) below Body .............................. 250°C for 3 secs
ESD Protection, R = 1.5 kΩ, C = 100 pF .............. V
Z
= 1 kV (each pin)
Note:
1. Maximum Voltage is with no LEDs illuminated.
HP [ AGILENT(HEWLETT-PACKARD) ]
