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HCPL4562 参数 Datasheet PDF下载

HCPL4562图片预览
型号: HCPL4562
PDF下载: 下载PDF文件 查看货源
内容描述: 高带宽,模拟/视频光电耦合器 [High Bandwidth, Analog/Video Optocouplers]
分类和应用: 光电
文件页数/大小: 17 页 / 266 K
品牌: HP [ HEWLETT-PACKARD ]
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Solder Reflow Temperature Profile (Gull Wing Surface Mount Option Parts)  
260  
240  
T = 145°C, 1°C/SEC  
220  
T = 115°C, 0.3°C/SEC  
200  
180  
160  
140  
120  
100  
80  
T = 100°C, 1.5°C/SEC  
60  
40  
20  
0
0
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TIME – MINUTES  
Note: Use of nonchlorine activated fluxes is highly recommended.  
Regulatory Information  
CSA  
BSI  
The devices contained in this data  
sheet have been approved by the  
following organizations:  
Approved under CSA Component  
Acceptance Notice #5, File CA  
88324.  
Certification according to  
BS415:1994  
(BS EN60065:1994);  
BS EN60950:1992  
UL  
VDE  
(BS7002:1992) and  
EN41003:1993 for Class II  
applications (HCNW4562 only).  
Recognized under UL 1577,  
Component Recognition  
Program, File E55361.  
Approved according to VDE  
0884/06.92 (HCNW4562 only).  
1-389  
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