Insulation and Safety Related Specifications
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking
Path (External Creepage)
Min. Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
CTI
Symbol Value Units
L(IO1)
L(IO2)
7.1
7.4
0.08
mm
mm
mm
Conditions
Measured from input terminals to output terminals,
shortest distance through air
Measured from input terminals to output terminals,
shortest distance path along body
Through insulation distance, conductor to conductor,
usually the direct distance between the photoemitter
and photodetector inside the optocoupler cavity
DIN IEC 112/VDE 0303 PART 1
200
V
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
(No derating required up to 70°C)
Parameter
Storage Temperature
Operating Temperature
Lead Soldering Cycle
Temperature
Time
Input Current
Average
Surge
Transient
Input Voltage (Pins 2-3)
Input Power Dissipation
Total Package Power Dissipation
Output Power Dissipation
Output Current
Average
Supply Voltage (Pins 8-5)
Output Voltage (Pins 6-5)
Solder Reflow Temperature Profile
Symbol
T
S
T
A
Min.
-55
-40
Max.
125
85
260
10
50
140
500
Units
°C
°C
°C
s
mA
Note
1
2
2, 3
I
IN
V
IN
P
IN
P
T
P
O
I
O
V
CC
V
O
-0.5
V
230
mW
305
mW
210
mW
30
mA
-0.5
20
V
-0.5
20
V
See Package Outline Drawings section
4
5
6
7
Recommended Operating Conditions
Parameter
Supply Voltage
Operating Temperature
Operating Frequency
Symbol
V
CC
T
A
f
Min.
2
0
0
Max.
18
70
4
Units
V
°C
kHz
8
Note
1-352
HP [ AGILENT(HEWLETT-PACKARD) ]
