Functional Diagrams
16 Pin DIP
Through Hole
2 Channels
1
V
B1
V
OC1
V
O1
GND
16
1
V
CC
V
B
V
OUT
8
1
V
CC
V
O1
V
O2
8
2
V
CC
V
O1
V
O2
V
O3
V
O4
GND
15
14
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
1
16
20 Pad LCCC
Surface Mount
2 Channels
15 14
V
CC2
19
20
V
B2
V
O2
GND
2
V
O1
GND
1
V
CC1
13
12
2
3
4
15
2
7
6
5
2
3
4
7
14
3
6
3
4
2
13
10
13
4
GND
GND
5
3
V
B1
9
7
8
5
V
B2
V
CC2
GND
V
O2
12
5
12
6
7
8
11
10
9
6
7
8
11
10
9
Note:
8 pin DIP and flat pack devices have common V
CC
and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages
have isolated channels with separate V
CC
and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
8.13 (0.320)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Leaded Device Marking
HP LOGO
HP P/N
DESC SMD*
DESC SMD*
PIN ONE/
ESD IDENT
HP QYYWWZ
XXXXXX
XXXXXXX
XXX USA
* 50434
* QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
HP FSCN*
Leadless Device Marking
HP LOGO
HP P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
HP QYYWWZ
XXXXXX
* XXXX
XXXXXX
USA 50434
*QUALIFIED PARTS ONLY
*QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DESC SMD*
DESC SMD*
HP FSCN*
1-561
HP [ AGILENT(HEWLETT-PACKARD) ]
