6
Insulation and Safety Related Specifications
8-Pin DIP
(300 mil)
Value
7.1
7.4
0.08
SO-8
Value
4.9
4.8
0.08
Parameter
Min.. External Air Gap
(External Clearance)
Min.. External Tracking
Path (External Creepage)
Min.. Internal Plastic
Gap (Internal Clearance)
Symbol
L(IO1)
L(IO2)
Units
mm
mm
mm
Conditions
Measured from input terminals to output
sterminals, hortest distance through air
Measured from input terminals to output
terminals, shortest distance path along body
Through insulation distance, conductor to
conductor, usually the direct distance between
the photoemitter and photodetector inside the
optocoupler cavity
DIN IEC 112/VDE 0303 PART 1
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
CTI
200
200
V
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Absolute Maximum Ratings
(No derating required up to 70°C)
Parameter
Storage Temperature
Operating Temperature
Lead Soldering Cycle
Input Current
Symbol
T
S
T
A
Temperature
Time
Average
Surge
Transient
HCPL-3700/3760
HCPL-0370
HCPL-3700/3760
HCPL-0370
HCPL-3700/3760
HCPL-0370
Average
Min.
-55
-40
Max.
125
85
260
10
50
140
500
Units
°C
°C
°C
s
mA
V
mW
mW
mW
mA
V
V
Note
1
2
2, 3
I
IN
V
IN
P
IN
-0.5
Input Voltage (Pins 2-3)
Input Power Dissipation
Total Package Power Dissipation
Output Power Dissipation
Output Current
Supply Voltage (Pins 8-5)
Output Voltage (Pins 6-5)
Solder Reflow Temperature Profile
230
172
P
T
305
275
P
O
210
103
I
O
30
V
CC
-0.5
20
V
O
-0.5
20
See Package Outline Drawings section
4
5
6
7
Recommended Operating Conditions
Parameter
Supply Voltage
Operating Temperature
Operating Frequency
Symbol
V
CC
T
A
f
Min.
2
0
0
Max.
18
70
4
Units
V
°C
kHz
8
Note
HP [ AGILENT(HEWLETT-PACKARD) ]
