20 SEC. MAX.
TEMPERATURE
240°C MAX.
3°C/SEC. MAX.
100-150°C
3°C/SEC.
MAX.
120 SEC. MAX.
TIME
60-150 SEC.
183°C
–6°C/SEC.
MAX.
Figure 6a. Recommended Sn-Pb reflow soldering profile.
10 to 20 SEC.
217
°C
TEMPERATURE
+5
°C
255
°C
-0
°C
6
°C/SEC.
MAX.
3
°C/SEC.
MAX.
125
°C ±
25
°C
MAX. 120 SEC.
60 to 150 SEC.
TIME
* THE TIME FROM 25
°C
TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 6b. Recommended Pb-free reflow soldering profile.
TURBULENT WAVE
250
200
150
FLUXING
LAMINAR WAVE
HOT AIR KNIFE
BOTTOM SIDE
OF PC BOARD
TEMPERATURE –
°C
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
100
50
30
0
10
PREHEAT
20
30
40
50
60
70
80
90
100
TIME – SECONDS
Figure 7. Recommended wave soldering profile.
5
HP [ AGILENT(HEWLETT-PACKARD) ]
