25.00~30.90MHz
38.90~45.00MHz
Group delay ripple (p-p)
37.0
29.0
-
43.0
35.0
40
-
-
-
dB
dB
Sidelobe
ns
Temperature coefficient
-72
ppm/k
2.3 Environmental Performance Characteristics
Item Test condition
Allowable change of absolute
Level at center frequency(dB)
High temperature test
70℃ 1000H
Low temperature test
-40℃ 1000H
< 1.0
< 1.0
< 1.0
Humidity test
40℃ 90-95% 1000H
Thermal shock
-20℃==25℃==80℃ 20 cycle
< 1.0
30M
10M
30M
Solder temperature test
Sold temp.260℃ for 10 sec.
Soldering
Immerse the pins melt solder
at 260℃+5/-0℃ for 5 sec.
< 1.0
More then 95% of total
area of the pins should
be covered with solder
2.4 Mechanical Test
Item
Test condition
Allowable change of absolute
Level at center frequency(dB)
Vibration test
600-3300rpm amplitude 1.5mm
3 directions 2 H each
Drop test
On maple plate from 1 m high 3 times
Lead pull test
<1.0
<1.0
<1.0
<1.0
Pull with 1 kg force for 30 seconds
Lead bend test
90o bending with 500g weigh 2 times
3
HOPERF [ HOPERF ]
