25.00~30.50MHz
35.0
42.0
-
dB
40.40~45.00MHz
30.0
38.0
-
dB
Temperature coefficient
-72
ppm/k
2.3 Environmental Performance Characteristics
Item Test condition
Allowable change of absolute
Level at center frequency(dB)
High temperature test
< 1.0
70℃ 1000H
Low temperature test
< 1.0
-40℃ 1000H
Humidity test
< 1.0
40℃ 90-95% 1000H
Thermal shock
< 1.0
-20℃==25℃==80℃ 20 cycle
30M
10M
30M
Solder temperature test
< 1.0
Sold temp.260℃ for 10 sec.
Soldering
More then 95% of total
Immerse the pins melt solder
area of the pins should
be covered with solder
at 260℃+5/-0℃ for 5 sec.
Sidelobe
2.4 Mechanical Test
Item
Test condition
Vibration test
600-3300rpm amplitude 1.5mm
3 directions 2 H each
Drop test
On maple plate from 1 m high 3 times
Lead pull test
Pull with 1 kg force for 30 seconds
Lead bend test
90
o
bending with 500g weigh 2 times
Allowable change of absolute
Level at center frequency(dB)
<1.0
<1.0
<1.0
<1.0
3
HOPERF [ Hope Microelectronics co., Ltd ]
