Group delay ripple
(p-p)
41.53 ~ 46.59 Mhz
Impedance at 44.06 Mhz
Input:
Zin = Rin//Cin
Output:
Zin = Rin//Cin
Temperature coefficient
-
-
-
-
40
-
1.3//16.1
1.1//5.6
-72
-
-
-
-
ns
-
kΩ//pF
kΩ//pF
ppm/K
2.3 Environmental Performance Characteristics
Item Test condition
Allowable change of absolute
Level at center frequency(dB)
High temperature test
< 1.0
70℃ 1000H
Low temperature test
< 1.0
-40℃ 1000H
Humidity test
< 1.0
40℃ 90-95% 1000H
Thermal shock
< 1.0
-20℃==25℃==80℃ 20 cycle
30M
10M
30M
Solder temperature test
< 1.0
Sold temp.260℃ for 10 sec.
Soldering
More then 95% of total
Immerse the pins melt solder
area of the pins should
be covered with solder
at 260℃+5/-0℃ for 5 sec.
2.4 Mechanical Test
Item
Test condition
Vibration test
600-3300rpm amplitude 1.5mm
3 directions 2 H each
Drop test
On maple plate from 1 m high 3 times
Lead pull test
Pull with 1 kg force for 30 seconds
Lead bend test
90
o
bending with 500g weigh 2 times
Allowable change of absolute
Level at center frequency(dB)
<1.0
<1.0
<1.0
<1.0
3
HOPERF [ Hope Microelectronics co., Ltd ]
