PACKAGE DIMENSIONS
18-PIN PLASTIC SMALL OUTLINE (SOIC) - WB
(Wide Body)
inches (millimeters)
Package Type: 18HW
.454 .008
(11.531 .20)
.0105 .0015
(.2667 .038
.4065 .0125
(10.325 .32)
.292 .005
(7.417 .13)
See Detail A
.0165 .003
(.419 .09)
.090 .010
(2.286 .254)
0° to 8°
.050
BSC
(1.27)
.0075 .0035
(.191 .089)
.033 .017
(.838 .43)
Detail A
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
44-PIN PLASTIC CHIP-SCALE PACKAGE
inches (millimeters)
Package Type: 44PCS
.276
BSC
.203 .006
(5.15 .15)
(7.00)
.020
(0.50)
BSC
.276
(7.00)
.203 .006
(5.15 .15)
Top View
Bottom
View
BSC
.010
(0.25)
typ
.016 .002
(0.40 .05)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.039
(1.00)
.008
(0.2)
max
typ
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
53
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
