HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
PIN DESCRIPTIONS
SYMBOL
FUNCTION
ANALOG
INPUT
DESCRIPTION
VREF
STROBE
SYNC
DATA (A)
CA
Ref. voltage used to determine output voltage swing. Pin sources current to allow use of a zener reference.
A logic high tri-states the ARINC outputs. Not available in the 14-pin SOIC package (tied to GND internally).
INPUT
Synchronizes data inputs
Data input terminal A
Connection for DATA (A) slew-rate capacitor
ARINC output terminal A
-12V to -15V
INPUT
INPUT
AOUT
-V
OUTPUT
POWER
POWER
POWER
OUTPUT
INPUT
GND
+V
0.0V
+12V to +15V
BOUT
CB
ARINC output terminal B
Connection for DATA (B) slew-rate capacitor
Data input terminal B
Synchronizes data inputs
+5V 5ꢀ
DATA (B)
CLOCK
V1
INPUT
INPUT
POWER
ABSOLUTE MAXIMUM RATINGS
All Voltages referenced to GND, TA = Operating Temperature Range (unless otherwise specified)
PARAMETER
Differential Voltage
Supply Voltage
SYMBOL
CONDITIONS
OPERATING RANGE
MAXIMUM
UNIT
VDIF
Voltage between +V and -V terminals
40
V
+V
-V
V1
+10.8 to +16.5
-10.8 to -16.5
+5 5ꢀ
V
V
V
+7
Voltage Reference
VREF
For ARINC 429
For Applications other than ARINC
+5 5ꢀ
1.5 to 6
6
6
V
V
Input Voltage Range
VIN
> GND -0.3
< V1 +0.3
V
V
Output Short-Circuit Duration
Output Overvoltage Protection
Operating Temperature Range
See Note: 1
See Note: 2
TA
High-temp & Military
Industrial
-55 to +125
-40 to +85
°C
°C
Storage Temperature Range
TSTG
Ceramic & Plastic
-65 to +150
°C
Lead Temperature
Soldering, 10 seconds
+275
+175
°C
°C
Junction Temperature
TJ
Note 1. Heatsinking may be required for continuous Output Short Circuit at +125°C and for 100KBPS at +125°C.
Note 2. The fuses used for Output Overvoltage Protection may be blown by the presence of a voltage at either output that is greater
than 12.0V with respect to GND. (HI-3182, 3184 & 3187 only)
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings
only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
HOLT INTEGRATED CIRCUITS
3
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
