HI-318X PACKAGE DIMENSIONS
inches (millimeters)
16-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
.405 ± .008
(10.287 ± .203)
.0105 ± .0015
(.2667 ± .0381)
Package Type: 16HWE
.240 ± .010
(6.096 ± .254)
.4065 ± .0125
(10.325 ± .318)
Top View
.295 ± .004
(7.493 ± .102)
.190 ± .010
(4.826 ± .254)
Bottom
View
Detail A
Electrically isolated metal
heat sink on bottom of
package
.090 ± .010
(2.286 ± .254)
(Connect to any ground or
power plane for optimum
thermal dissipation)
0° to 8°
.050 ± .010
(1.270 ± .254)
.0165 ± .0035
(.4191 ± .0889)
.033 ± .017
(.838 ± .432)
.0025 ± .0015
(.0635 ± .0381)
Detail A
16-PIN CERAMIC SIDE-BRAZED DIP
Package Type: 16C
.810 MAX
(20.574 MAX)
.295 ± .010
(7.493 ± .254)
.050 ± .005
(1.270 ± .127)
.035 ± .010
(.889 ± .254)
BASE
PLANE
.125 MIN
(3.175 MIN)
.018 ± .002
(.457 ± .051)
SEATING
PLANE
.100 BSC
(2.540 BSC)
.300 ± .010
(7.620 ± .254)
PIN 1
.200 MAX
(5.080 MAX)
.010 ± .002
(.254 ± .051)
HOLT INTEGRATED CIRCUITS
9
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
