HI-318X PACKAGE DIMENSIONS
28-PIN CERAMIC LEADLESS CHIP CARRIER
inches (millimeters)
Package Type: 28S
.020
INDEX
(.508)
PIN 1
.080
±.020
(2.032
±.508)
PIN 1
.050
±.005
(1.270
±.127)
.451
±.009
(11.455
±.229)
SQ.
.050
BSC
(1.270)
.008R ± .006
(.203R
±.152)
.040 x 45° 3PLS
(1.016 x 45° 3PLS)
.025
±.003
(.635
±.076)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
32-PIN J-LEAD CERQUAD
inches (millimeters)
Package Type: 32U
31
32
1
2
.450
±.008
(11.430
±.203)
.488
±.008
(12.395
±.203)
.420
±.012
(10.668
±.305)
.588
±.008
(14.935
±.203)
.550
±
.009
(13.970
±
.229)
.190 max
(4.826)
.083
±.009
(2.108
±.229)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.040
typ
(1.016)
.050
.019
±
.003
BSC
(1.270)
(.483
±
.076)
.520
±.012
(13.208
±.305)
HOLT INTEGRATED CIRCUITS
12
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
