HI-318X PACKAGE DIMENSIONS
16-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
.405 ± .008
(10.287 ± .20)
.0105 ± .0015
(.2667 ± .038)
inches (millimeters)
Package Type: 16HWE
.240
(6.10)
typ
.407 ± .013
(10.34 ± .32)
Top View
.295 ± .004
(7.49 ± .10)
.190
typ
(4.83)
Bottom
View
See Detail A
.090 ± .010
(2.286 ± .254)
.0165 ± .003
(.419 ± .089)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.050
BSC
(1.27)
0° to 8°
.033 ± .017
(.838 ± .432)
.0025 ± .002
(.064 ± .038)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
Detail A
16-PIN CERAMIC SIDE-BRAZED DIP
inches (millimeters)
Package Type: 16C
.810
max
(20.574)
.295
±.010
(7.493
±.254)
.050
±.005
(1.270
±.127)
.035 ± .010
(.889
±.254)
BASE
PLANE
SEATING
PLANE
.100
BSC
(2.54)
.300 ± .010
(7.620
±.254)
PIN 1
.200
max
(5.080)
.125 min
(3.175)
.010
±.002
(.254
±.051)
.018 ± .002
(.457
±.051)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
10
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
