PACKAGE DIMENSIONS
8-PIN PLASTIC SMALL OUTLINE (SOIC) - NB
(Narrow Body)
inches (millimeters)
Package Type: 8HN
.193
BSC
(4.90)
.007 .003
(.175 .075)
.236
(6.00)
.154 .004
(3.90 .09)
BSC
PIN 1
See Detail A
.016 .004
(.410 .10)
1.25 min.
0° to 8°
.007 .003
(.175 .075)
.050
(1.27)
.033 .017
(.835 .435)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
BSC
Detail A
16-PIN PLASTIC CHIP-SCALE PACKAGE
millimeters
Package Type: 16PCS
Electrically isolated metal
heat sink on bottom of
package
Connect to any ground or
power plane for optimum
thermal dissipation
2.60 .05
4.00 BSC
0.65 BSC
Bottom
View
Top View
4.00 BSC
2.60 .05
0.30 .05
0.40 .05
1.00 max
0.20 typ
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
12
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
