PACKAGE DIMENSIONS
8-PIN PLASTIC SMALL OUTLINE (SOIC) - NB
(Narrow Body)
4.90
BSC
(0.193)
millimeters (inches)
Package Type: 8HN
0.175 ± 0.075
(0.007 ± 0.003)
6.00
BSC
(0.236)
P
IN
1
3.90
BSC
(0.154)
See Detail A
0.41 ± 0.10
(0.016 ± 0.004)
1.25
(0.049)
min.
0° to 8°
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
1.27
BSC
(0.050)
0.835 ± 0.435
(0.033 ± 0.017)
0.175 ± 0.075
(0.007 ± 0.003)
Detail A
16-PIN PLASTIC CHIP-SCALE PACKAGE
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
millimeters(inches)
Package Type: 16PCS
4.000
BSC
(0.157)
2.600 ± 0.050
(0.102 ± 0.002)
4.000
BSC
(0.157)
Top View
2.600 ± 0.050
(0.102 ± 0.002)
Bottom
View
0.65
(0.0256)
BSC
0.300 ± 0.050
(0.012 ± 0.002)
0.400 ± 0.050
(0.016 ± 0.002)
1.000
(0.039)
max.
0.200
(0.008)
typ.
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
12
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
