HI-2581 参数 Datasheet PDF下载

HI-2579, HI-2581

PACKAGE DIMENSIONS

Bottom View

.660 ± .007

(16.76 ± .18)

.060 TYP.

(1.52)

.218

(5.54)

Dimensions in inches (mm)

.044 SQ. 6X

(1.12 SQ.)

24X

.025

(.64)

R.017 24X

(R.43)

2X

.080

(2.03)

.510 ± .007

(12.95 ± .18)

.600 ± .007

(15.24 ± .18)

HOLT INTEGRATED CIRCUITS

10

.080

(2.03)

24X

R.008

(R.20)

PIN 1 INDEX

Notes:

1.

2.

3.

Heatsink pad is electrically isolated from the IC die and may be connected to the board’s VDD or GND plane to remove heat.

The “keep out” zones (crosshatched) enclose test pads for the transformer primary windings. DO NOT CONNECT.

Routing traces under test pads is not recommended.

23X .050

(1.27)

.183

(4.65)