PACKAGE DIMENSIONS
20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
.0105 ± .0015
(.267 ± .038)
inches (millimeters)
Package Type: 20HWE
.504 ± .008
(12.79 ± .19)
.290 typ
(7.37)
.407 ± .013
(10.325 ± .32)
Top View
.295 ± .002
(7.493 ± .05)
.205 typ
(5.21)
Bottom
View
See Detail A
.0165 ± .0035
(.419 ± .089)
.090 ± .01
(2.29 ± .25)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.050
BSC
(1.27)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
0° to 8°
.033 ± .017
(.838 ± .432)
.0075 ± .004
(.191 ± .089)
Detail A
20-PIN CERAMIC SIDE-BRAZED DIP
1.000
±.010
(25.400
±.254)
.310
±.010
(7.874
±.254)
.050 TYP.
(1.270 TYP.)
.200
max
(5.080)
.085
±.009
(2.159
±
.229)
inches (millimeters)
Package Type: 20C
.300
± .010
(7.620
±
.254)
.125 min
(3.175)
.017
±.002
(.432
±.051)
.100
BSC
(2.54)
.010
+
002/-.001
.
(.254
±.051/-
.025)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
9
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
