PACKAGE DIMENSIONS
44-PIN PLASTIC CHIP-SCALE PACKAGE (QFN)
.276
BSC
(7.00)
inches (millimeters)
Package Type: 44PCS
.203 ± .006
(5.15 ± .15)
.020 BSC
(0.50)
.276
BSC
(7.00)
Top View
.203 ± .006
(5.15 ± .15)
Bottom
View
.010
(0.25) typ
.039
max
(1.00)
.008 typ
(0.2)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.016 ± .002
(0.40 ± .05)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
10
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
