PACKAGE DIMENSIONS
20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
inches (millimeters)
Package Type: 20HWE
.0105 .0015
.290
typ
(7.37)
(.267 .038)
.504 .008
(12.79 .19)
.407 .013
(10.325 .32)
.205
(5.21)
Bottom
View
.295 .002
(7.493 .05)
typ
Top View
See Detail A
.0165 .0035
(.419 .089)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.090 .01
(2.29 .25)
.050
BSC
(1.27)
0° to 8°
.0075 .004
(.191 .089)
.033 .017
(.838 .432)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
Detail A
20-PIN CERAMIC SIDE-BRAZED DIP
inches (millimeters)
Package Type: 20C
1.000 ±.010
(25.400 ±.254)
.310 ±.010
(7.874 ±.254)
.050 TYP.
(1.270 TYP.)
.300 ± .010
(7.620 ± .254)
.085 ±.009
(2.159 ± .229)
.200
(5.080)
max
.125
(3.175)
.100
BSC
min
.010 + 0. 02/-.001
(.254 ±.051/-.025)
(2.54)
.017 ±.002
(.432 ±.051)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
10
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
