HI-1575
THERMAL CHARACTERISTICS
Data taken at VDD = 3.3V, continuous data transmission at 1 Mbit/s, single transmitter enabled.
PART NUMBER
HI-1575PQI / T
HI-1575PCI / T
PACKAGE STYLE
32 pin PQFP
40 pin LPCC
CONDITION
Mounted on
circuit board
Heat sink pad
soldered
q
JA
59.5
°C / W
27.5
°C / W
JUNCTION TEMPERATURE
T
A
= 25°C T
A
= 85°C T
A
= 125°C
TBD°C
TBD°C
TBD°C
TBD°C
TBD°C
TBD°C
ORDERING INFORMATION
HI - 1575 xx x x
PART
NUMBER
LEAD
FINISH
Blank
F
PART
NUMBER
Tin / Lead (Sn / Pb) Solder
100% Matte Tin (Pb-free, RoHS compliant)
TEMPERATURE
RANGE
FLOW
BURN
IN
I
T
M
PART
NUMBER
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
PACKAGE
DESCRIPTION
I
T
M
NO
NO
YES
PQ
PC
32 PIN PLASTIC PQFP
40 PIN CHIP SCALE PACKAGE (PCM not available)
HOLT INTEGRATED CIRCUITS
11
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
